Alcohol and water based flux
Alcohol- and water-based fluxes, also called hybrid fluxes, have been developed for use in wave- and selective soldering. These fluxes have a very wide range of applications, with very good soldering properties, in particular with the step-through and the wetting of the circuit board. The process window is very wide, with high thermal stability. After the application of the flux, the circuit boards are visually clean.
Especificaciones
| Especificaciones | |||||
| Product | Solids content | Application area | Activators | ||
| ELM/KF | not applicable Gew.-% | Dip- and strand tinning, special applications | di-carboxylic acids | ||
| EO-F-001 | 2.4 – 2.6% Gew.-% | Foam fluxing, spray fluxing, selective soldering, hand soldering, dip soldering | (di-) carboxylic acids – resin complex | ||
| EO-F-001/OVAP | 2.4 – 2.6% Gew.-% | Spray fluxing, selective soldering, hand soldering, dip soldering | (di-) carboxylic acids – resin complex | ||
| EO-F-002 | 2,6 – 2,8% Gew.-% | Foam fluxing, spray fluxing, selective soldering, hand soldering, dip soldering | (di-) carboxylic acids – resin complex | ||
| EO-F-002/OVAP | 2,6 – 2,8% Gew.-% | Spray fluxing, selective soldering, hand soldering, dip soldering | (di-) carboxylic acids – resin complex | ||
| EO-Y-001 | 2.7 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids | ||
| EO-Y-003 | 3.3 Gew.-% | Wave- and selective soldering | di-carboxylic acids, resin free | ||
| EO-Y-004 | 3.5–3.7 Gew.-% | Wave- and selective soldering | di-carboxylic acids | ||
| EO-Y-005A | 2.0 Gew.-% | Wave- and selective soldering | dicarboxylic acids, synthetic resin | ||
| EO-Y-005B | 3.0 Gew.-% | Wave- and selective soldering | di-carboxylic acids, synthetic resin | ||
| EO-Y-005C | 4.0 Gew.-% | Wave- and selective soldering | di-carboxilic acids, resin | ||
| EO-Y-006A | 1,9-2,2 Gew.-% | Wave- and selective soldering | di-carboxylic acids, synthetic resin | ||
| EO-Y-006B | 3.0-3,2 Gew.-% | Wave- and selective soldering | di-carboxylic acids, synthetic resin | ||
| EO-Y-006C | 3.9-4,2 Gew.-% | Wave- and selective soldering | di-carboxylic acids, synthetic resin | ||
| EO-Y-006C/75 | 3,9 – 4,2 % | Wave- and selective soldering Versión con LOW VOC (75%) y secado mejorado vs. base agua | (di-)carboxylic acids con resina sintética. ORL0. | ||
| EO-Y-014A | 2% (1,9 – 2,1%) Gew.-% | Wave- and selective-soldering | Dicarboxilic acids, Resin | ||
| EO-Y-014B | 3 % (2,9 – 3,1 %) Gew.-% | Wave- and selective-soldering | Dicarboxilic acids, Resin | ||
| EO-Y-014C | 4 % (3,8 – 4,2 %) Gew.-% | Wave- and selective-soldering | Dicarboxilic acids, Resin | ||
| SD-35 | 3.5 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids | ||
| WB-35/SP | 3.5 Gew.-% | di-carboxylic acids | |||
