Flux Dispensador Bottles
All solar fluxes have been developed for the soldering of solar modules, tabber- and stringer material, as well as the connecting of cells. Furthermore, the products are NO-CLEAN fluxes, that are formulated halogen-free. All fluxes leave no sticky residues behind. This has been verified in process tests with well-known mechanical engineers from the stringer technology sector. In addition, the activators are designed specifically for high temperatures, that are required during the manufacture of solar modules, without the efficiency of the activators thereby being affected. This also applies for the actual application in particularly hot and sunny regions.
Especificaciones
| Especificaciones | |||
| Product | Solids content | Application area | Activators |
| EO-B-001A (Multiflux) | 2.2 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-001B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content |
| EO-B-002B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-B-007C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content |
| EO-Flux-Dosing bottle EO-RF-G002, Plus EO-Compact-Flux-Pen | 3,9 – 4,1 % Gew.-% | Selective soldering, manualsoldering | Carboxylic- and dicarboxylic-acid-complex / Activator system from FLUX EO-G-002 (#6015) |
| EO-Flux-Dosing bottle EO-RF-WB30, Plus EO-Compact-Flux-Pen | 3,9 – 4,1% Gew.-% | Selective soldering, manualsoldering | Carboxylic- and dicarboxylic-acid-complex / Activator system from Flux WB-30… systems |
| EO-Flux-Dosing bottle EO-RF-WB35, Plus EO-Compact-Flux-Pen | 3,9 – 4,1 % Gew.-% | Selective soldering, manualsoldering | Carboxylic- and dicarboxylic-acid-complex / Activator system from Flux WB-35… systems |
| EO-RF-G003 | 3,9 – 4,1 % Gew.-% | Selective soldering, manual soldering | Carboxylic- and dicarboxylic-acid-complex |
| HR/D-110 | 5.8 Gew.-% | Selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, resins |
| PM-334 (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content |
| RS-4004 (Multiflux) | 3.5 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content |
| Solder Tincture WFF | approx. 38 Gew.-% | Manual-, repair- and dip soldering, soldering on ceramic substrates, strand tinning | balsamic resin, di-corboxylic acids, halogenated amine |
| SSK-15 (No-Clean) | 15.0 Gew.-% | Manual- and repair soldering, dip soldering | di-carboxylic acids, resins |
