{"id":3179,"date":"2022-09-19T09:10:05","date_gmt":"2022-09-19T09:10:05","guid":{"rendered":"https:\/\/bwit.es\/?post_type=product&p=3179"},"modified":"2022-09-19T10:14:38","modified_gmt":"2022-09-19T10:14:38","slug":"martin-expert-10-6-rs","status":"publish","type":"product","link":"https:\/\/bwit.es\/producto\/martin-expert-10-6-rs\/","title":{"rendered":"MARTIN | Expert 10.6 RS"},"content":{"rendered":"
Equipamiento est\u00e1ndar<\/strong><\/p>\n Estaci\u00f3n de retrabajo semiautom\u00e1tica con sistema Gantry para componentes peque\u00f1os a muy grandes y masivos. El probado calentador de suelo h\u00edbrido permite un calentamiento cuidadoso de tableros con dimensiones de hasta 500 x 500 mm\u00b2.\n\n
\n \nEspecificaciones<\/td>\n<\/tr>\n<\/thead>\n \n Power consumption:<\/td>\n 5,500 VA<\/td>\n<\/tr>\n \n Power solder pen:<\/td>\n 400 W, 35 l\/min<\/td>\n<\/tr>\n \n Power under-heating system:<\/td>\n 1,200 – 5,000 W<\/td>\n 6 x IR-lamps<\/td>\n<\/tr>\n \n Size under-heating system:<\/td>\n 420 x 450 mm\u00b2<\/td>\n<\/tr>\n \n Max. PCB size:<\/td>\n 500 x 500 mm\u00b2<\/td>\n<\/tr>\n \n Resolution motion system:<\/td>\n 0.001 mm<\/td>\n<\/tr>\n \n Placement accuracy:<\/td>\n \u00b1 0.015 mm<\/td>\n (Flip Chip)*<\/td>\n<\/tr>\n \n Placement accuracy:<\/td>\n \u00b1 0.030 mm<\/td>\n (CSP)<\/td>\n<\/tr>\n \n Placement accuracy:<\/td>\n \u00b1 0.040 mm<\/td>\n (BGA)<\/td>\n<\/tr>\n \n Placement accuracy:<\/td>\n \u00b1 0.070 mm<\/td>\n (Maxi BGA)*<\/td>\n<\/tr>\n \n Size of component:<\/td>\n Flip Chip min<\/td>\n 0.2 mm<\/td>\n 0.2 mm<\/td>\n<\/tr>\n \n Size of component:<\/td>\n Flip Chip max<\/td>\n 15 mm<\/td>\n 12 mm<\/td>\n<\/tr>\n \n Size of component:<\/td>\n CSP min<\/td>\n 0.5 mm<\/td>\n 0.5 mm<\/td>\n<\/tr>\n \n Size of component:<\/td>\n CSP max<\/td>\n 35 mm<\/td>\n 25 mm<\/td>\n<\/tr>\n \n Size of component:<\/td>\n BGA min<\/td>\n 1 mm<\/td>\n 1 mm<\/td>\n<\/tr>\n \n Size of component:<\/td>\n BGA max<\/td>\n 45 mm<\/td>\n 35 mm<\/td>\n<\/tr>\n \n Size of component:<\/td>\n Maxi BGA min<\/td>\n 2 mm<\/td>\n 2 mm<\/td>\n<\/tr>\n \n Size of component:<\/td>\n Maxi BGA max<\/td>\n 70 mm<\/td>\n 55 mm<\/td>\n<\/tr>\n \n Mains:<\/td>\n 1Phase, 230VAC, Fuse 16A<\/td>\n Connector Type CEE 32A (3 phase)<\/td>\n<\/tr>\n \n Pressurized air:<\/td>\n 5-8 bar, 100 l\/min<\/td>\n clean, dry air<\/td>\n<\/tr>\n \n Dimensions:<\/td>\n 1030 x 630 mm2<\/td>\n<\/tr>\n \n Weight:<\/td>\n 85 kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"
\nPara un manejo seguro de todos los componentes, el sistema de posicionamiento preciso puede navegar a cualquier punto de la placa de circuito impreso. El posicionamiento previo se realiza a trav\u00e9s del p\u00f3rtico XY de funcionamiento suave, mientras que el posicionamiento y la colocaci\u00f3n precisos son completamente autom\u00e1ticos utilizando la tecnolog\u00eda\/precisi\u00f3n fiable de Martin.<\/p>\n