Alcohol-based flux
Alcohol-based fluxes have a very wide range of applications. The fluxes have very good soldering properties, in particular with the step-through and the wetting of the circuit board. The process window is very wide, with high thermal stability and good process activity over a long time interval. The residue behavior is also very good, the circuit boards are very clean after the soldering process.
Especificaciones
| Especificaciones | |||||
| Product | Solids content | Application area | Activators | ||
| EO-B-001A (Multiflux) | 2.2 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content | ||
| EO-B-001B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content | ||
| EO-B-001C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-002A (Multiflux) | 2.2 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-002B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-002B/X (Multiflux) | 3 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | carboxylic and dicarboxylic acids – activator complex, rosin | ||
| EO-B-002C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-004 (Multiflux) | 1.8 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content | ||
| EO-B-006A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-006B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-006C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-007A (Multiflux) | 1.9 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-007B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-007C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-008 (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content | ||
| EO-B-009A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, no resin content | ||
| EO-B-009B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-009C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-010A (Multiflux) | 2.0 % Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | Di-carboxylic acids, synthetic resin complex | ||
| EO-B-010B (Multiflux) | 2,6% Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, synthetic resin complex | ||
| EO-B-010C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, synthetic resin complex | ||
| EO-B-013 (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | halogen-free (di-)carboxylic acid complex | ||
| EO-B-016 (Multiflux) | 5 % (4,9 – 5,3 %) Gew.-% | Wave and selective soldering processes, as well as for manual soldering processes, dip soldering processes and strand tinning. | Di-Carboxylic acid activator resin complex (ISO-9454: 1231) | ||
| EO-B-023A | 1,9 – 2,1 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | Resin-carboxylic and dicarboxylic acidscomplex | ||
| EO-B-023B | 2,8 – 3,2 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | Resin-carboxylic and dicarboxylic acids- complex | ||
| EO-B-023C | 3,8 – 4,2 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | resin-carboxylic and dicarboxylic acidscomplex | ||
| EO-B-023D | 5,8 – 6,2 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | resin-carboxylic and dicarboxylic acids- complex | ||
| EO-B-023E | 14,8 – 15,2 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | resin-carboxylic and dicarboxylic acids- complex | ||
| EO-B-024A | 2,0 – 2,2 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | carboxylic and dicarboxylic acids, resin-complex | ||
| EO-B-024B | 3,1 – 3,4 Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | carboxylic and dicarboxylic acids, resin-complex | ||
| EO-RF-G002 | 3,9 – 4,1 Gew.-% | Selective soldering, manualsoldering | Activator system of EO-G-002 (EO cat. no.: 6015), (di-)carboxylic acid complex | ||
| EO-RF-G003 | 3,9 – 4,1 % Gew.-% | Selective soldering, manual soldering | Carboxylic- and dicarboxylic-acid-complex | ||
| EO-RF-WB30 | 3,9 – 4,1 Gew.-% | Selective soldering, manual soldering | activator system of WB-30… (and variants), (di-)carboxylic acid complex | ||
| EO-RF-WB35 | 3,9 – 4,1 Gew.-% | Selective soldering, manual soldering | activator system of WB-35… (and variants), (di-)carboxylic acid complex | ||
| GSP-2533/RX | 2.5 Gew.-% | Wave soldering (spray- and foam fluxing) | synthetic resin with di-carboxylic acids | ||
| GSP-2533/RX/OVAP | 2.5 Gew.-% | Wave soldering (spray fluxing) | synthetic resin with di-carboxylic acids | ||
| GSP-2633/RX (Multiflux) | 2,6% (2,5 – 2,7 %) Gew.-% | Wave soldering (spray- and foam fluxing) and selective soldering | (Di-) carboxylic acid complex with synthetic resin (Resin) | ||
| GSP-2633/RX/OVAP (Multiflux) | 2,6% (2,5 – 2,7 %) Gew.-% | Wave- and selective soldering | (Di-) carboxylic acid complex with synthetic resin (Resin) | ||
| GSP-2933/RX (Multiflux) | 2,9% (2,8 – 3,1 %) Gew.-% | Wave- and selective soldering | (Di-) carboxylic acid complex with synthetic resin (Resin) | ||
| GSP-2933/RX/OVAP (Multiflux) | 2,9% (2,8 – 3,1 %) Gew.-% | Wave- and selective soldering | (Di-) carboxylic acid complex with synthetic resin (Resin) | ||
| HR/D-110 | 5.8 Gew.-% | Selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, resins | ||
| PM-334 (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content | ||
| RS-4004 (Multiflux) | 3.5 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, minimal resin content | ||
| S-250/FR | 2.5 Gew.-% | Wave soldering (spray- and foam fluxing) | synthetic resin with di-carboxylic acids | ||
| S-250/FRO | 2.5 Gew.-% | Wave soldering (spray fluxing) | di-carboxylic acids with synthetic resin | ||
| Solder Tincture WFF | approx. 38 Gew.-% | Manual-, repair- and dip soldering, soldering on ceramic substrates, strand tinning | balsamic resin, di-corboxylic acids, halogenated amine | ||
| SSK-15 (No-Clean) | 15.0 Gew.-% | Manual- and repair soldering, dip soldering | di-carboxylic acids, resins | ||
