Flux concentrates
Los concentrados de flux de Emil Otto son de particular interés para los clientes que requieren grandes cantidades de flux o fabricación en el extranjero. Todos los granulados se pueden transportar sin identificación de sustancias peligrosas y con una reducción significativa de tamaño. Un flux se convierte en una sustancia peligrosa si contiene alcohol, entre otras cosas. Los concentrados de flux están libres de esto ya que el cliente mezcla el alcohol o la mezcla de alcohol y agua en el sitio. La mezcla del fundente es muy sencilla, ya que cada concentrado contiene la información necesaria, qué líquido hay que añadir al concentrado y en qué dosis. Las cantidades de granulado son suficientes para 10 o 20 litros. Además, los granulados se pueden envasar más fácilmente y con menor volumen, lo que también reduce los costes de transporte. Debido a estas optimizaciones de transporte, los concentrados de flux se pueden transportar económicamente a largas distancias, ya que los transportistas cobran costos muy bajos por mercancías no peligrosas. Los concentrados incluyen fluxes para soldadura por ola y selectiva, así como soldadura manual y por inmersión.
Especificaciones
| Especificaciones | |||||
| Product | Solids content | Application area | Activators | ||
| EO-B-001A (Multiflux) | 2.2 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content | ||
| EO-B-001B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content | ||
| EO-B-001C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, low resin content | ||
| EO-B-002A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-002B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-002B/X (Multiflux) | 3 % Gew.-% | Wave-, selective- and manual soldering processes, as well as cable assembly | carboxylic and dicarboxylic acids – activator complex, rosin | ||
| EO-B-002C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-006A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-006B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-006C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-007A (Multiflux) | 1.9 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-007B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-007C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, very low resin content | ||
| EO-B-009A (Multiflux) | 2.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | di-carboxylic acids, no resin content | ||
| EO-B-009B (Multiflux) | 3.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-009C (Multiflux) | 4.0 Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | non-halogen, di-carboxylic acids, no resin content | ||
| EO-B-011B | 3,0 % Gew.-% | Wave-, selective- and hand-soldering | dicarboxylic acids, synthetic resin complex | ||
| EO-MC-001 | Gew.-% | Wave- and selective soldering, manual- and repair soldering, dip soldering | organic hydrohalogen complex | ||
| EO-Y-004 | 3.5–3.7 Gew.-% | Wave- and selective soldering | di-carboxylic acids | ||
| GSP-25/AF/OVAP | 2,5 Gew.-% | Wave- and selective soldering | di-dicarboxylic acids | ||
